3M™ 583 Thermal Bonding Film is a high strength, flexible, nitrile phenolic based thermoplastic bonding film. It can be heat or solvent activated for bonding. This film can also be lightly crosslinked using a post heat exposure. This crosslinking will provide additional heat and solvent resistance as well as somewhat higher shear strength.

Appropriate application equipment can enhance bonding film performance. The type of application equipment used to bond 3M thermal bonding film 583 will depend on the application involved and on the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or three-dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding is chosen by the user, the optimum bonding conditions should be predetermined with substrates specific to the user’s application.