Melexis presents a package option, featuring an integrated decoupling capacitor, for its existing 2-wire Hall-effect switch and latch sensor ICs. This  package option enables PCB-less modules and assemblies while retaining the EMI/ESD performance necessary in harsh-duty environments. The pin ordering for this option is optimized to allow wider clearance and direct connection via welding or soldering to a connector or an insert molded lead frame connector. This avoids any secondary operations typically consisting of bending of the leads to match the common 0.1”/2.54 mm spacing of automotive or industrial, standard, sealed wire harness connectors. Melexis was able to maintain the existing TO-92 “UA” industry standard SIP package outside dimensions. Assuring compatibility with existing designs and simplifying cost saving upgrades to current assemblies and modules.