UMFT60xx Development Modules

By FTDI, Future Technology Devices International Ltd 68

UMFT60xx Development Modules

The UMFT60xA and UMFT60xX range of evaluation/development modules with either high-speed mezzanine card (HSMC) or field programmable mezzanine card (FMC) (LPC) connectors for interfacing FTDI’s FT60x USB 3.0 SuperSpeed IC with external hardware. The series allows for bridging a FIFO bus to a USB 3.0 host and evaluating the functionality of the FT60x. As a daughter card, the UMFT60xx must work with a FIFO master board which has either an FMC or HSMC connector. There are four models which provide different FIFO bus interfaces and data bit widths. The series supports two parallel slave FIFO bus protocols (multi-channel FIFO / 245 synchronous FIFO) with a data “burst” rate of up to 400 MB/s.

Features

  • Support for USB 3.0 SuperSpeed (5 Gbps), USB high-speed (480 Mbps) and USB 2.0 full-speed (12 Mbps) transfer
  • Four IN channels and four OUT channels on FIFO bus connectivity
  • Supports multi voltage I/O: 1.8 V, 2.5 V, and 3.3 V
  • High-speed connector for FIFO bus: FMC or HSMC
  • Multi-powered options: external DC powered, BUS powered, FMC/HSMC powered
  • Hardware reset and remote wake up
  • Micro-USB 3.0 receptacle

नयाँ सामानहरू:

UMFT600A-BUMFT601A-BUMFT600X-BUMFT601X-B

कोटीहरू

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