By ITT Interconnect Solutions 114
With the increasing demand for compact, ruggedized interconnect solutions that can withstand temperatures up to 200°C, ITT’s Cannon brand continues to lead the industry with high reliability products customized for applications from satellites to down-hole analyzers.
Micro-D Backshells - MDM Series
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नयाँ सामानहरू:
MDM-9SH006B-F222MDM-9PH006B-F222MDM-15SH006B-F222MDM-15PH006B-F222MDM-21SH006B-F222MDM-21PH006B-F222MDM-25SH006B-F222MDM-25PH006B-F222MDM-31SH006B-F222MDM-31PH006B-F222MDM-37SH006B-F222MDM-9SCBR-F222MDM-9PCBR-F222MDM-9SH006B-A174-F222MDM-9SCBR-A174-F222MDM-15PCBR-A174-F222MDM-21PCBR-A174-F222MDM-25SCBR-A174-F222MDM-25PCBR-A174-F222MDM-37PCBR-A174-F222