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ECF840AAACN-C1-Y3

ECF840AAACN-C1-Y3
Mfr. #:
ECF840AAACN-C1-Y3
निर्माता:
Micron
विवरण:
DRAM LPDDR3 8G Die 256MX32
जीवन चक्र:
यस निर्माताबाट नयाँ।
डाटा पाना:
ECF840AAACN-C1-Y3 डाटा पाना
डेलिभरी:
DHL FedEx Ups TNT EMS
भुक्तानी:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
थप जानकारी:
ECF840AAACN-C1-Y3 थप जानकारी ECF840AAACN-C1-Y3 Product Details
उत्पादन विशेषता
विशेषता मान
निर्माता:
माइक्रोन टेक्नोलोजी
उत्पादन कोटि:
DRAM
प्रकार:
SDRAM - LPDDR3
डाटा बस चौडाइ:
32 bit
संगठन:
256 M x 32
प्याकेज / केस:
मर्नुहोस्
मेमोरी साइज:
8 Gbit
शृङ्खला:
ECF
प्याकेजिङ:
ट्रे
ब्रान्ड:
माइक्रोन
उत्पादन प्रकार:
DRAM
कारखाना प्याक मात्रा:
1
उपश्रेणी:
मेमोरी र डाटा भण्डारण
Tags
ECF84, ECF8, ECF
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
LPDDR3 8G DIE 256MX32
***i-Key
IC DRAM 8G PARALLEL
भाग # Mfg। विवरण स्टक मूल्य
ECF840AAACN-C1-Y3
DISTI # ECF840AAACN-C1-Y3-ND		Micron Technology IncIC DRAM 8G PARALLEL
RoHS: Compliant
Min Qty: 1
Container: Bulk		Limited Supply - Call
    ECF840AAACN-C1-Y3
    DISTI # ECF840AAACN-C1-Y3    		Micron Technology IncLPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3)
    RoHS: Compliant
    Min Qty: 1
    Container: Waffle Pack    		Americas - 0
      ECF840AAACN-C1-Y3-ES
      DISTI # ECF840AAACN-C1-Y3-ES      		Micron Technology IncLPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3-ES)
      RoHS: Compliant
      Min Qty: 1
      Container: Waffle Pack      		Americas - 0
        ECF840AAACN-C1-Y3
        DISTI # 340-293524        		Micron Technology IncDRAM LPDDR3 8G Die 256MX320
        • 1:$23.3400
        • 10:$21.7400
        • 25:$21.5000
        • 50:$20.9700
        • 100:$18.4100
        • 250:$17.7900
        छवि भाग # विवरण
        ECF840AAACN-C1-Y3

        Mfr.#: ECF840AAACN-C1-Y3

        OMO.#: OMO-ECF840AAACN-C1-Y3

        		 DRAM LPDDR3 8G Die 256MX32
        ECF840AAACN-C1-Y3

        Mfr.#: ECF840AAACN-C1-Y3

        OMO.#: OMO-ECF840AAACN-C1-Y3-MICRON-TECHNOLOGY

        		 IC DRAM 8G PARALLEL
        ECF840AAACN-C2-Y3

        Mfr.#: ECF840AAACN-C2-Y3

        OMO.#: OMO-ECF840AAACN-C2-Y3-MICRON-TECHNOLOGY

        		 IC DRAM 8G PARALLEL
        ECF840AAACN-Y3

        Mfr.#: ECF840AAACN-Y3

        OMO.#: OMO-ECF840AAACN-Y3-1190

        		 LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-Y3)
        उपलब्धता
        स्टक:
        Available
        अर्डर मा:
        4000
        मात्रा प्रविष्ट गर्नुहोस्:
        ECF840AAACN-C1-Y3 को हालको मूल्य सन्दर्भको लागि मात्र हो, यदि तपाइँ उत्तम मूल्य प्राप्त गर्न चाहनुहुन्छ भने, कृपया हाम्रो बिक्री टोली sales@omo-ic.com मा सोधपुछ वा प्रत्यक्ष इमेल पेश गर्नुहोस्।
        सन्दर्भ मूल्य (USD)
        मात्रा
        एकाइ मूल्य
        विस्तार मूल्य
        1
        US$ २३.३४
        US$ २३.३४
        10
        US$ २१.७४
        US$ २१७.४०
        25
        US$ २१.५०
        US$ ५३७.५०
        50
        US$ २०.९७
        US$ १ ०४८.५०
        100
        US$ १८.४१
        US$ १ ८४१.००
        250
        US$ १७.७९
        US$ ४ ४४७.५०
        500
        US$ १७.३१
        US$ ८ ६५५.००
        2021 देखि कम आपूर्तिमा अर्धचालकको कारण, तलको मूल्य 2021 अघि सामान्य मूल्य हो। कृपया पुष्टि गर्न सोधपुछ पठाउनुहोस्।
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