CY7C1312BV18-200BZC

CY7C1312BV18-200BZC
Mfr. #:
CY7C1312BV18-200BZC
निर्माता:
Cypress Semiconductor
विवरण:
SRAM 1Mx18 1.8V COM QDR II SRAM
जीवन चक्र:
यस निर्माताबाट नयाँ।
डाटा पाना:
CY7C1312BV18-200BZC डाटा पाना
डेलिभरी:
DHL FedEx Ups TNT EMS
भुक्तानी:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
थप जानकारी:
CY7C1312BV18-200BZC थप जानकारी CY7C1312BV18-200BZC Product Details
उत्पादन विशेषता
विशेषता मान
निर्माता:
साइप्रस सेमीकन्डक्टर
उत्पादन कोटि:
SRAM
RoHS:
N
मेमोरी साइज:
18 Mbit
संगठन:
1 M x 18
अधिकतम घडी आवृत्ति:
200 MHz
इन्टरफेस प्रकार:
समानान्तर
आपूर्ति भोल्टेज - अधिकतम:
1.9 V
आपूर्ति भोल्टेज - न्यूनतम:
1.7 V
हालको आपूर्ति - अधिकतम:
675 mA
न्यूनतम परिचालन तापमान:
0 C
अधिकतम परिचालन तापमान:
+ 70 C
माउन्टिङ शैली:
SMD/SMT
प्याकेज / केस:
FBGA-165
डाटा दर:
QDR
मेमोरी प्रकार:
QDR
शृङ्खला:
CY7C1312BV18
प्रकार:
सिंक्रोनस
ब्रान्ड:
साइप्रस सेमीकन्डक्टर
पोर्ट संख्या:
2
नमी संवेदनशील:
हो
उत्पादन प्रकार:
SRAM
कारखाना प्याक मात्रा:
136
उपश्रेणी:
मेमोरी र डाटा भण्डारण
Tags
CY7C1312BV18-20, CY7C1312BV18-2, CY7C1312B, CY7C1312, CY7C131, CY7C13, CY7C1, CY7C, CY7
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA
***or
IC SRAM 18MBIT PARALLEL 165FBGA
***DA Technology Co., Ltd.
Product Description Demo for Development.
***i-Key
IC SRAM 18MBIT 200MHZ 165FBGA
***ure Electronics
CY7C1412KV18 Series 1.9V 18 Mb (1 M x 18) 250 MHz Surface Mount SRAM - FBGA-165
***et
SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray
*** Stop Electro
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165
***ponent Stockers USA
1M X 18 QDR SRAM 0.45 ns PBGA165
***ress Semiconductor SCT
Synchronous SRAM, BGA-165, RoHS
***i-Key
IC SRAM 18MBIT PARALLEL 165FBGA
***ure Electronics
CY7C1320JV18 18 Mb (512 K x 36) 1.8V 250 MHz DDR-II 2-Word Burst SRAM-FBGA-165
***et
SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
***ponent Stockers USA
512K X 36 DDR SRAM 0.45 ns PBGA165
***i-Key
IC SRAM 18MBIT PARALLEL 165FBGA
***or
DDR SRAM, 512KX36, 0.45NS, CMOS,
भाग # Mfg। विवरण स्टक मूल्य
CY7C1312BV18-200BZC
DISTI # CY7C1312BV18-200BZC-ND
Cypress SemiconductorIC SRAM 18M PARALLEL 165FBGA
RoHS: Not compliant
Min Qty: 136
Container: Tray
Limited Supply - Call
    CY7C1312BV18-200BZC
    DISTI # 727-CYC312BV18200BZC
    Cypress SemiconductorSRAM 1Mx18 1.8V COM QDR II SRAM
    RoHS: Not compliant
    0
      CY7C1312BV18-200BZCCypress SemiconductorQDR SRAM, 1MX18, 0.45ns
      RoHS: Not Compliant
      132
      • 1000:$30.5300
      • 500:$32.1300
      • 100:$33.4500
      • 25:$34.8900
      • 1:$37.5700
      छवि भाग # विवरण
      CY7C1312BV18-167BZC

      Mfr.#: CY7C1312BV18-167BZC

      OMO.#: OMO-CY7C1312BV18-167BZC

      SRAM 1Mx18 1.8V COM QDR II SRAM
      CY7C1312BV18-250BZC

      Mfr.#: CY7C1312BV18-250BZC

      OMO.#: OMO-CY7C1312BV18-250BZC

      SRAM 1Mx18 1.8V COM QDR II SRAM
      CY7C1312BV18-167BZC

      Mfr.#: CY7C1312BV18-167BZC

      OMO.#: OMO-CY7C1312BV18-167BZC-CYPRESS-SEMICONDUCTOR

      IC SRAM 18M PARALLEL 165FBGA
      CY7C1312BV18-167BZCES

      Mfr.#: CY7C1312BV18-167BZCES

      OMO.#: OMO-CY7C1312BV18-167BZCES-CYPRESS-SEMICONDUCTOR

      नयाँ र मौलिक
      CY7C1312BV18-167BZI

      Mfr.#: CY7C1312BV18-167BZI

      OMO.#: OMO-CY7C1312BV18-167BZI-CYPRESS-SEMICONDUCTOR

      IC SRAM 18M PARALLEL 165FBGA
      CY7C1312BV18-167BZXC

      Mfr.#: CY7C1312BV18-167BZXC

      OMO.#: OMO-CY7C1312BV18-167BZXC-CYPRESS-SEMICONDUCTOR

      नयाँ र मौलिक
      CY7C1312BV18-200BZ

      Mfr.#: CY7C1312BV18-200BZ

      OMO.#: OMO-CY7C1312BV18-200BZ-CYPRESS-SEMICONDUCTOR

      नयाँ र मौलिक
      CY7C1312BV18-200BZC

      Mfr.#: CY7C1312BV18-200BZC

      OMO.#: OMO-CY7C1312BV18-200BZC-CYPRESS-SEMICONDUCTOR

      IC SRAM 18M PARALLEL 165FBGA
      CY7C1312BV18-200BZI

      Mfr.#: CY7C1312BV18-200BZI

      OMO.#: OMO-CY7C1312BV18-200BZI-CYPRESS-SEMICONDUCTOR

      IC SRAM 18M PARALLEL 165FBGA
      CY7C1312BV18-250BZXC

      Mfr.#: CY7C1312BV18-250BZXC

      OMO.#: OMO-CY7C1312BV18-250BZXC-CYPRESS-SEMICONDUCTOR

      नयाँ र मौलिक
      उपलब्धता
      स्टक:
      Available
      अर्डर मा:
      3500
      मात्रा प्रविष्ट गर्नुहोस्:
      CY7C1312BV18-200BZC को हालको मूल्य सन्दर्भको लागि मात्र हो, यदि तपाइँ उत्तम मूल्य प्राप्त गर्न चाहनुहुन्छ भने, कृपया हाम्रो बिक्री टोली sales@omo-ic.com मा सोधपुछ वा प्रत्यक्ष इमेल पेश गर्नुहोस्।
      बाट सुरु गर्नुहोस्
      नवीनतम उत्पादनहरू
      • PSoC® 4 BLE 256 KB Module with Bluetooth®
        Cypress' PSoC 4 BLE 256 KB device, two crystals for the antenna matching network, a PCB antenna and other passives, while providing access to all GPIOs of the device.
      • T543 Series COTS Polymer Electrolytic
        KEMET Organic Capacitor (KO-CAP) is a solid electrolytic capacitor with a conductive polymer cathode capable of delivering low ESR and capacitance retention at high frequencies.
      • HK Series Inductors
        TAIYO YUDEN's HK series inductors have expanded to include price competitive, AEC-Q200 qualified high-reliability version inductors.
      • Piezoelectric Acoustic Modules
        KEMET's multilayer piezoelectric bimorph actuators are ceramic elements used to convert electrical energy into mechanical energy such as displacement or force.
      • Compare CY7C1312BV18-200BZC
        CY7C1312BV18200BZ vs CY7C1312BV18200BZC vs CY7C1312BV18200BZI
      • CY8CKIT-042-BLE Bluetooth® Low Energy Develop
        The Cypress CY8CKIT-042-BLE development kit supports system-level designs including example projects to enable Bluetooth Low Energy mixed-signal embedded designs.
      Top