 |  |  | |
| PartNumber | BDN0153 | BDN09-3CB | BDN09-3CB/A01 |
| Description | HEATSINK CPU .91" SQ | Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized | |
| Manufacturer | - | CTS Thermal Management Products | CTS Thermal Management Products |
| Product Category | - | Thermal - Heat Sinks | Thermal - Heat Sinks |
| Material | - | Aluminum | Aluminum |
| Series | - | BDN | BDN |
| Type | - | Top Mount | Top Mount |
| Length | - | 0.910" (23.11mm) | 0.910" (23.11mm) |
| Width | - | 0.910" (23.11mm) | 0.910" (23.11mm) |
| Shape | - | Square, Pin Fins | Square, Pin Fins |
| Diameter | - | - | - |
| Package Cooled | - | Assorted (BGA, LGA, CPU, ASIC...) | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | - | Thermal Tape, Adhesive (Not Included) | Thermal Tape, Adhesive (Included) |
| Height Off Base Height of Fin | - | 0.355" (9.02mm) | 0.355" (9.02mm) |
| Power Dissipation Temperature Rise | - | - | - |
| Thermal Resistance Forced Air Flow | - | 9.6°C/W @ 400 LFM | 9.6°C/W @ 400 LFM |
| Thermal Resistance Natural | - | 26.9°C/W | 26.9°C/W |
| Material Finish | - | Black Anodized | Black Anodized |