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BGT70E6327XTSA1

BGT70E6327XTSA1
Mfr. #:
BGT70E6327XTSA1
निर्माता:
Infineon Technologies
विवरण:
RF Transceiver MM-WAVE-MMICS
जीवन चक्र:
यस निर्माताबाट नयाँ।
डाटा पाना:
BGT70E6327XTSA1 डाटा पाना
डेलिभरी:
DHL FedEx Ups TNT EMS
भुक्तानी:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
उत्पादन विशेषता
विशेषता मान
निर्माता:
इन्फिनोन
उत्पादन कोटि:
आरएफ ट्रान्सीभर
प्रकार:
LTE, WiMAX
प्याकेज / केस:
WFWLB-119
प्याकेजिङ:
रील
ब्रान्ड:
Infineon टेक्नोलोजीहरू
उत्पादन प्रकार:
आरएफ ट्रान्सीभर
कारखाना प्याक मात्रा:
1000
उपश्रेणी:
वायरलेस र आरएफ एकीकृत सर्किट
भाग # उपनाम:
70 BGT E6327 SP001267810
Tags
BGT70E, BGT7, BGT
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Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
RF Transceiver 3.3V 119-Pin WFWLB T/R
***ineon SCT
Developed for telecommunication only, WFWLB-119-1, RoHS
***ineon
Summary of Features: Developed for telecommunication only; Support FDD and TDD systems (in full duplex or half-duplex mode); Support modulation schemes: QPSK, QAM; Support small cell backhaul (up to 1000m); Support Macrocell backhaul (external PA needed depending on output power requirement); Direct conversion I/Q transceiver; IF bandwidth 1000MHz; Differential RF/IF interface for lower loss and better isolation; Integration of VCO (Voltage Controller Oscillator) signal generation; PNssb (Phase Noise single side band) < -80dBc/Hz @ 100kHz offset; 10dBm linear output power (sufficient for small cells); 7dB NF (Noise Figure); Integrated power detection function; Integrated thermal sensor; eWLB (embedded Wafer Level Ball Grid Array) packaged device | Benefits: Packaged solution, easy to use and standard SMT flow formounting on customer system; Highly integrated RF transceiver requiring no external RF discretes, thereby simplifying the customer design and time-to-market; Architecture of Direct Conversion Zero IF eases interface to latest modem/BB designs (no external filter); A transceiver approach with implemented BIST (B uilt-In S elf-T est)on the chip to enable RF testing at Infineon production; Family concept (common architecture, package, pinning) simplifies customer designs due to modular approach
भाग # Mfg। विवरण स्टक मूल्य
BGT70E6327XTSA1
DISTI # BGT70E6327XTSA1-ND		Infineon Technologies AGIC RF TXRX CELLULAR 119WFBGA
RoHS: Compliant
Min Qty: 1000
Container: Tape & Reel (TR)		Temporarily Out of Stock
  • 1000:$60.2640
BGT70E6327XTSA1
DISTI # SP001267810		Infineon Technologies AGRF Transceiver 3.3V 119-Pin WFWLB T/R (Alt: SP001267810)
RoHS: Compliant
Min Qty: 1000
Container: Tape and Reel		Europe - 152
  • 1000:€61.1900
  • 2000:€58.6900
  • 4000:€56.3900
  • 6000:€52.3900
  • 10000:€48.8900
BGT70E6327XTSA1
DISTI # BGT70E6327XTSA1		Infineon Technologies AGRF Transceiver 3.3V 119-Pin WFWLB T/R - Tape and Reel (Alt: BGT70E6327XTSA1)
RoHS: Compliant
Min Qty: 1000
Container: Reel		Americas - 0
  • 1000:$69.9900
  • 2000:$67.4900
  • 4000:$64.9900
  • 6000:$62.7900
  • 10000:$61.6900
BGT70E6327XTSA1
DISTI # 726-BGT70E6327XTSA1		Infineon Technologies AGRF Transceiver MM-WAVE-MMICS0
  • 1000:$60.1200
BGT 70 E6327
DISTI # 726-BGT70E6327		Infineon Technologies AGRF Transceiver MM-WAVE-MMICS0
  • 1000:$60.1200
BGT70E6327XTSA1
DISTI # XSKDRABV0032764		Infineon Technologies AG 
RoHS: Compliant		800
  • 800:$77.6300
  • 6:$83.1700
छवि भाग # विवरण
BGT70E6327XTSA1

Mfr.#: BGT70E6327XTSA1

OMO.#: OMO-BGT70E6327XTSA1

 RF Transceiver MM-WAVE-MMICS
BGT70E6327XTMA1

Mfr.#: BGT70E6327XTMA1

OMO.#: OMO-BGT70E6327XTMA1-1190

 Transceiver QPSK/QAM 3.3V 119-Pin WFWLB T/R - Tape and Reel (Alt: BGT70E6327XTMA1)
BGT70E6327XTSA1

Mfr.#: BGT70E6327XTSA1

OMO.#: OMO-BGT70E6327XTSA1-INFINEON-TECHNOLOGIES

 IC RF TXRX CELLULAR 119WFBGA
उपलब्धता
स्टक:
Available
अर्डर मा:
5000
मात्रा प्रविष्ट गर्नुहोस्:
BGT70E6327XTSA1 को हालको मूल्य सन्दर्भको लागि मात्र हो, यदि तपाइँ उत्तम मूल्य प्राप्त गर्न चाहनुहुन्छ भने, कृपया हाम्रो बिक्री टोली sales@omo-ic.com मा सोधपुछ वा प्रत्यक्ष इमेल पेश गर्नुहोस्।
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