Riedon's modern, high-power surface mount chips replace standard TO-126 (25 W) SMT packages with a PCB pad compatible chip only 1 mm (0.04”) thick, a decrease in thickness of over 75%. In addition to the size advantage, the PFC is over 25% less expensive than standard TO style SMT packages.

The back of the chip is metallized for excellent thermal dissipation to your PCB and/or heat sink. Wrap around terminations bring the connections to the top of the chip where a high quality, power film resistor resides.