IPDiA's Wire Bonding Silicon Capacitors (E.SC) exhibit ideal characteristics for Chip On Board (COB) assembly solutions. The E.SC Capacitor targets power supply decoupling and filtering of active devices. The range is from 390 pF to 4.7 µF, with voltage ratings of 11 V or 30 V breakdown voltage. The size of the dies range from 0202 up to 2016. The E.SC Capacitor is based on PICS Integrated Passive technology, and directly mounted on the PCB application using wire bonding. E.SC capacitors have the outer bonding pads in aluminum.